Pick and Place Process Optimization for Thin Semiconductor Packages

Selective Pick-and-Place of Thin Film by Robotic Micromanipulation

Micro-engineering is increasingly interested in the use of thin films with thicknesses of less than 20nm. Before integrating these promising materials into complex Nano Electro Mechanical Systems (NEMS), their properties must be characterized. They must be transferred onto specific substrates for analysis. Current manipulation techniques are not suitable for the transfer of these thin films as ...

Approximation Algorithms for Pick-and-Place Robots

In this paper we study the problem of finding placement tours for pick-and-place robots, also known as the printed circuit board assembly problem with m positions on a board, n bins containing m components and n locations for the bins. In the standard model where the working time of the robot is proportional to the distances travelled, the general problem appears as a combination of the travell...

Stepwise Deceleration for Pick and Place Applications

In this paper we present a method that has been developed for fast stopping in pick and place robotic applications with high inertia loads and self-blocking transmissions. The latter is the case of worm gears and power transmission screws. Hence a desired trajectory can be executed at maximum speed and near optimal time with a controlled overloading of the torque at the transmission output shaf...

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

Process Optimization of Deposition Conditions for Low Temperature Thin Film Insulators used in Thin Film Transistors Displays

Deposition process for thin insulator used in polysilicon gate dielectric of thin film transistors are optimized. Silane and N2O plasma are used to form SiO2 layers at temperatures below 150 ºC. The deposition conditions as well as system operating parameters such as pressure, temperature, gas flow ratios, total flow rate and plasma power are also studied and their effects are discussed.  The p...